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YNL05S100xy DC-DC Converter Family Data Sheet
3.0 to 5.5 VDC Input; 0.9 to 3.3 VDC @ 10 A Output
The
Products: Y-Series
Features
? RoHS lead-free solder and lead-solder-exempted
products are available
? Delivers up to 10 A (33 W)
? No derating up to 85 ? C
? Surface-mount package
? Industry-standard footprint and pinout
? Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98 mm)
? Weight: 0.22 oz [6.12 g]
Applications
? Co-planarity less than 0.003”, maximum
? Synchronous Buck Converter topology
?
?
?
?
?
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
? Start-up into pre-biased output
? No minimum load required
? Programmable output voltage via external resistor
? Operating ambient temperature: -40 °C to 85 °C
? Remote output sense
? Remote ON/OFF (positive or negative)
? Fixed-frequency operation
Benefits
? High efficiency – no heat sink required
? Reduces total solution board area
? Tape and reel packing
? Compatible with pick & place equipment
? Auto-reset output overcurrent protection
? Auto-reset overtemperature protection
? High reliability, MTBF = 32.54 million hours
calculated per Telcordia TR-332, Method I Case 1
? All materials meet UL94, V-0 flammability rating
? UL60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN60950
Description
The YNL05S100xy non-isolated DC-DC converters deliver up to 10 A of output current in an industry-standard
surface-mount package. Operating from a 3.0 to 5.5 VDC input, the YNL05S100xy converters are ideal choices
for Intermediate Bus Architectures where Point-of-Load (POL) power delivery is generally a requirement. The
converters are available in individual output voltage versions, allowing coverage of the output voltage range from
0.9 to 3.3 VDC. Each version is capable of providing an extremely tight, highly regulated and trimmable output.
The YNL05S100xy converters provide exceptional thermal performance, even in high temperature environments
with no airflow. No derating is required up to 85 ? C, without airflow at natural convection. This performance is
accomplished through the use of advanced circuitry, packaging, and processing techniques to achieve a design
possessing ultra-high efficiency, excellent thermal management, and a very low-body profile.
The low-body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
MCD10188 Rev. 1.0, 21-Jun-10
Page 1 of 23
www.power-one.com
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